Vacuum Solder Reflow Oven HVR Series
This is an inline vacuum solder reflow furnace compatible with voidless flux-free technology.
Recently, with the evolution of power semiconductors and advanced packaging, high-quality solder joints are in demand. Therefore, void (bubble) suppression and flux-free solder reflow have become essential. The HVR series can reduce the void rate to less than 1% by evacuating the chamber, allowing voids to escape from the molten solder. Additionally, by using formic acid as a reducing gas, it supports flux-free soldering. A feature of the HVR series is that the solder reflow process (reduction, solder melting, cooling) is continuously processed in a single chamber, and product transport is fully automated by robots. This concept enables inline product input and retrieval, improving productivity by connecting units. We have a demonstration unit available, so if you would like to see the actual machine or request a solder joint demonstration, please feel free to contact us.
- Company：伯東 本社
- Price：Other
